The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2014

Filed:

May. 15, 2012
Applicants:

Tzu-yen Hsieh, Taipei, TW;

Ming-ching Chang, Hsinchu, TW;

Yuan-sheng Huang, Taichung, TW;

Ming-chia Tai, Hsinchu, TW;

Chao-cheng Chen, Shin-Chu, TW;

Inventors:

Tzu-Yen Hsieh, Taipei, TW;

Ming-Ching Chang, Hsinchu, TW;

Yuan-Sheng Huang, Taichung, TW;

Ming-Chia Tai, Hsinchu, TW;

Chao-Cheng Chen, Shin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes receiving a semiconductor device, patterning a first hard mask to form a first recess in a high-resistor (Hi-R) stack, removing the first hard mask, forming a second recess in the Hi-R stack, forming a second hard mask in the second recess in the Hi-R stack. A HR can then be formed in the semiconductor substrate by the second hard mask and a gate trench etch.


Find Patent Forward Citations

Loading…