The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Oct. 24, 2008
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Yoshikuni Tateyama, Oita, JP;
Hiroyuki Yano, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Yukiteru Matsui, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Yoshikuni Tateyama, Oita, JP;
Hiroyuki Yano, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
There is disclosed a chemical mechanical polishing method of an organic film comprising forming the organic film above a semiconductor substrate, contacting the organic film formed above the semiconductor substrate with a polishing pad attached to a turntable, and dropping a slurry onto the polishing pad to polish the organic film, the slurry being selected from the group consisting of a first slurry and a second slurry, the first slurry comprising a resin particle having a functional group selected from the group consisting of an anionic functional group, a cationic functional group, an amphoteric functional group and a nonionic functional group, and having a primary particle diameter ranging from 0.05 to 5 μm, the first slurry having a pH ranging from 2 to 8, and the second slurry comprising a resin particle having a primary particle diameter ranging from 0.05 to 5 μm, and a surfactant having a hydrophilic moiety.