The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8679962 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 25, 2014

Filed:

Nov. 04, 2008
Applicants:

Yong-tian Hou, Singapore, SG;

Chien-hao Chen, Chuangwei Township, Ilan County, TW;

Donald Y. Chao, Hsinchu, TW;

Cheng-lung Hung, Hsinchu, TW;

Inventors:

Yong-Tian Hou, Singapore, SG;

Chien-Hao Chen, Chuangwei Township, Ilan County, TW;

Donald Y. Chao, Hsinchu, TW;

Cheng-Lung Hung, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a gate structure is provided. The method includes providing a metal layer in the gate structure, the metal layer includes an oxygen-gettering composition. The metal layer getters oxygen from the interface layer, which may decrease the thickness of the interface layer. The gettered oxygen converts the metal layer to a metal oxide, which may act as a gate dielectric for the gate structure. A multi-layer metal gate structure is also provided including a oxygen-gettering metal layer, an oxygen-containing metal layer, and a polysilicon interface metal layer overlying a high-k gate dielectric.


Find Patent Forward Citations

Hou, Yong-Tian. (2014). Integrated circuit metal gate structure and method of fabrication (U.S. Patent No. 8679962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8679962

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