The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
May. 24, 2011
Kei Murayama, Nagano, JP;
Shigeaki Suganuma, Nagano, JP;
Masakuni Kitajima, Nagano, JP;
Ryuichi Matsuki, Nagano, JP;
Hiroyuki Miyajima, Nagano, JP;
Kei Murayama, Nagano, JP;
Shigeaki Suganuma, Nagano, JP;
Masakuni Kitajima, Nagano, JP;
Ryuichi Matsuki, Nagano, JP;
Hiroyuki Miyajima, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A heat radiation component configured to be provided through a thermal interface material on a semiconductor device mounted on a board includes a first layer to be positioned on a first side and a second layer stacked on the first layer to be positioned on a second side farther from the semiconductor device than the first side. The coefficient of thermal expansion of the second layer is lower than the coefficient of thermal expansion of the first layer.