The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Jul. 26, 2010
Chung-ying Yang, Taoyuan, TW;
Chao-wen Shih, Zhubei, TW;
Hao-yi Tsai, Hsin-Chu, TW;
Hsien-wei Chen, Sinying, TW;
Mirng-ji Lii, Sinpu Township, TW;
Tzuan-horng Liu, Longtan Township, TW;
Chung-Ying Yang, Taoyuan, TW;
Chao-Wen Shih, Zhubei, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Hsien-Wei Chen, Sinying, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Tzuan-Horng Liu, Longtan Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device includes a package substrate including a first non-reflowable metal bump extending over a top surface of the package substrate; a die over and bonded to the package substrate; and a package component over the die and bonded to the package substrate. The package component includes a second non-reflowable metal bump extending below a bottom surface of the package component. The package component is selected from the group consisting essentially of a device die, an additional package substrate, and combinations thereof. A solder bump bonds the first non-reflowable metal bump to the second non-reflowable metal bump.