The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
May. 20, 2011
Shuang-ji Tsai, Tainan County, TW;
Dun-nian Yaung, Taipei, TW;
Jen-cheng Liu, Hsin-Chu, TW;
Jeng-shyan Lin, Tainan, TW;
Wen-de Wang, Chiayi County, TW;
Yueh-chiou Lin, Taichung County, TW;
Shuang-Ji Tsai, Tainan County, TW;
Dun-Nian Yaung, Taipei, TW;
Jen-Cheng Liu, Hsin-Chu, TW;
Jeng-Shyan Lin, Tainan, TW;
Wen-De Wang, Chiayi County, TW;
Yueh-Chiou Lin, Taichung County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A semiconductor device including a device substrate having a front side and a back side. The semiconductor device further includes an interconnect structure disposed on the front side of the device substrate, the interconnect structure having a n-number of metal layers. The semiconductor device also includes a bonding pad disposed on the back side of the device substrate, the bonding pad extending through the interconnect structure and directly contacting the nth metal layer of the n-number of metal layers.