The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Sep. 05, 2013
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Sung Mun Jung, Singapore, SG;
Swee Tuck Woo, Singapore, SG;
Sanford Chu, Singapore, SG;
Liang Choo Hsia, Singapore, SG;
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a device is disclosed. The method includes providing a substrate and forming a device layer on the substrate having a formed thickness T. A capping layer is formed on the substrate having a formed thickness T. Forming the capping layer consumes a desired amount of the device layer to cause the thickness of the device layer to be about the target thickness T. The thickness of the capping layer is adjusted from Tto about a target thickness T.