The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Sep. 30, 2011
Richard H. Gaylord, Saratoga Springs, NY (US);
Blaze J. Messer, Albany, NY (US);
Kaushik A. Kumar, Poughkeepsie, NY (US);
Richard H. Gaylord, Saratoga Springs, NY (US);
Blaze J. Messer, Albany, NY (US);
Kaushik A. Kumar, Poughkeepsie, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of forming a semiconductor device. A substrate having first and second materials is provided, wherein the second material is occluded by the first material. The substrate is etched using a first non-plasma etch process that etches the first material at a higher rate relative to a rate of etching the second material. The first non-plasma etch process exposes the second material that is overlying at least a portion of the first material. The second material is then etched using a plasma containing a reactive gas, which exposes the at least a portion of the first material. The first material including the at least a portion of the first material that was exposed by etching the second material are etched using a second non-plasma etch process.