The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Jan. 28, 2009
Stephen E. Lehman, Jr., Chandler, AZ (US);
James C. Matayabas, Jr., Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Stephen E. Lehman, Jr., Chandler, AZ (US);
James C. Matayabas, Jr., Chandler, AZ (US);
Saikumar Jayaraman, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.