The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Feb. 09, 2012
Peter J. Lindgren, Essex Junction, VT (US);
Edmund J. Sprogis, Underhill, VT (US);
Anthony K. Stamper, Williston, VT (US);
Peter J. Lindgren, Essex Junction, VT (US);
Edmund J. Sprogis, Underhill, VT (US);
Anthony K. Stamper, Williston, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods of forming through wafer vias (TWVs) and standard contacts in two separate processes to prevent copper first metal layer puddling and shorts are presented. In one embodiment, a method may include forming a TWV into a substrate and a first dielectric layer over the substrate; forming a second dielectric layer over the substrate and the TWV; forming, through the second dielectric layer, at least one contact to the TWV and at least one contact to other structures over the substrate; and forming a first metal wiring layer over the second dielectric layer, the first metal wiring layer contacting at least one of the contacts.