The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Sep. 14, 2010
Applicants:
Khalil Hosseini, Weihmichl, DE;
Frank Kahlmann, Neubiberg, DE;
Josef Hoeglauer, Kirchheim-Heimstetten, DE;
Ralf Otremba, Kaufbeuren, DE;
Georg Meyer-berg, Munich, DE;
Inventors:
Khalil Hosseini, Weihmichl, DE;
Frank Kahlmann, Neubiberg, DE;
Josef Hoeglauer, Kirchheim-Heimstetten, DE;
Ralf Otremba, Kaufbeuren, DE;
Georg Meyer-Berg, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A die structure includes a die and a metallization layer disposed over the front side of the die. The metallization layer includes copper. At least a part of the metallization layer has a rough surface profile. The part with the rough surface profile includes a wire bonding region, to which a wire bonding structure is to be bonded.