The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Apr. 08, 2010
Chang-hsiao Lee, Tainan County, TW;
Yu-tsung Lai, Tai-Chung Hsien, TW;
Jiunn-hsiung Liao, Tainan Hsien, TW;
Chang-Hsiao Lee, Tainan County, TW;
Yu-Tsung Lai, Tai-Chung Hsien, TW;
Jiunn-Hsiung Liao, Tainan Hsien, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A method for filling a metal is disclosed. First, a substrate is provided. The substrate includes a metal material layer, a dielectric layer covering the metal material layer and a hard mask layer covering the dielectric layer. The hard mask layer has at least one opening to expose the underlying dielectric layer. Second, a dry etching step is performed to etch the dielectric layer through the opening to remove part of the dielectric layer to expose the metal material layer and to form a recess and leave some residues in the recess. Then a cleaning step is performed to remove the residues and to selectively remove part of the hard mask to substantially enlarge the opening. Later, a metal fills the recess through the enlarged opening.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile