The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Nov. 14, 2012
Ramprakash Sankarakrishnan, San Jose, CA (US);
Dale R. Du Bois, Los Gatos, CA (US);
Ganesh Balasubramanian, Sunnyvale, CA (US);
Karthik Janakiraman, San Jose, CA (US);
Juan Carlos Rocha-alvarez, San Carlos, CA (US);
Thomas Nowak, Cupertino, CA (US);
Visweswaren Sivaramakrishnan, Cupertino, CA (US);
Hichem M'saad, Sunnyvale, CA (US);
Ramprakash Sankarakrishnan, San Jose, CA (US);
Dale R. Du Bois, Los Gatos, CA (US);
Ganesh Balasubramanian, Sunnyvale, CA (US);
Karthik Janakiraman, San Jose, CA (US);
Juan Carlos Rocha-Alvarez, San Carlos, CA (US);
Thomas Nowak, Cupertino, CA (US);
Visweswaren Sivaramakrishnan, Cupertino, CA (US);
Hichem M'Saad, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method and apparatus for cleaning a process chamber are provided. In one embodiment, a process chamber is provided that includes a remote plasma source and a process chamber having at least two processing regions. Each processing region includes a substrate support assembly disposed in the processing region, a gas distribution system configured to provide gas into the processing region above the substrate support assembly, and a gas passage configured to provide gas into the processing region below the substrate support assembly. A first gas conduit is configured to flow a cleaning agent from the remote plasma source through the gas distribution assembly in each processing region while a second gas conduit is configured to divert a portion of the cleaning agent from the first gas conduit to the gas passage of each processing region.