The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Jul. 31, 2009
Applicants:
Heejo Chi, Ichon si, KR;
Namju Cho, Uiwang-si, KR;
Yeongim Park, Suwon, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base having a through-conductor and having an insulator protecting the base and the through-conductor; mounting a chip over the base and connected to the base with a first interconnect; forming a second interconnect above the base and horizontally beside the chip; and encapsulating the chip, the first interconnect, and the second interconnect with an encapsulation.
Quick Actions:
Chi, HeeJo. (2013). Integrated circuit packaging system with through silicon via base and method of manufacture thereof (U.S. Patent No. 8587129). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8587129
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile