The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Apr. 06, 2011
Brett Busch, Boise, ID (US);
Gowri Damarla, Boise, ID (US);
Anurag Jindal, Boise, ID (US);
Chia-yen Ho, New Taipei, TW;
Thy Tran, Boise, ID (US);
Brett Busch, Boise, ID (US);
Gowri Damarla, Boise, ID (US);
Anurag Jindal, Boise, ID (US);
Chia-Yen Ho, New Taipei, TW;
Thy Tran, Boise, ID (US);
Nanya Technology Corp., Kueishan, Tao-Yuan Hsien, TW;
Abstract
A blanket stop layer is conformally formed on a layer with a large step height. A first chemical mechanical polishing process is performed to remove the blanket stop layer atop the layer in the raised region. A second chemical mechanical polishing process is performed to planarize the wafer using the blanket stop layer as a stop layer when the layer is lower than or at a same level as the blanket stop layer or using the layer as a stop layer when the blanket stop layer is lower than or at a same level as the layer, or a selective dry etch is performed to remove the layer in the raised region. Thus, the layer in the raised region can be easily removed without occurrence of dishing in the non-raised region which is protected by the blanket stop layer.