The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8571699 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 29, 2013

Filed:

Sep. 10, 2010
Applicants:

Chen-fa LU, Gangshan Township, TW;

Cheng-ting Chen, Taichung, TW;

James HU, Hsinchu, TW;

Chung-shi Liu, Shin-Chu, TW;

Inventors:

Chen-Fa Lu, Gangshan Township, TW;

Cheng-Ting Chen, Taichung, TW;

James Hu, Hsinchu, TW;

Chung-Shi Liu, Shin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.


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Lu, Chen-Fa. (2013). System and method to reduce pre-back-grinding process defects (U.S. Patent No. 8571699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8571699

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