The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Mar. 25, 2011
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Frederick Rodriguez Gahilig, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Frederick Rodriguez Gahilig, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a post of multiple plating layers having a base end with an inward protrusion, a connect riser, and a top end opposite the base end; positioning an integrated circuit device having a perimeter end facing the connect riser and the inward protrusion; attaching a bond wire directly on the inward protrusion and the integrated circuit device; and applying an encapsulation over the integrated circuit device, the bond wire, the inward protrusion, and around the post, the encapsulation exposing a portion of the base end and the top end of the post.