The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Oct. 09, 2012
Applicant:
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Inventors:
Hongyu Wang, Wilmington, DE (US);
David Mosley, Philadelphia, PA (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polishing composition and method is provided, wherein the low-k dielectric material removal rate remains stable following the polishing of a 110polished wafer in a plurality of wafers to be polished.
Wang, Hongyu. (2013). Chemical mechanical polishing composition and method (U.S. Patent No. 8545715). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8545715
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile