The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
May. 21, 2010
Thomas A. Ponnuswamy, Sherwood, OR (US);
John H. Sukamto, Lake Oswego, OR (US);
Jonathan D. Reid, Sherwood, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Thomas A. Ponnuswamy, Sherwood, OR (US);
John H. Sukamto, Lake Oswego, OR (US);
Jonathan D. Reid, Sherwood, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Novellus Systems, Inc., Fremont, CA (US);
Abstract
Disclosed are methods of depositing a copper seed layer to be used for subsequent electroplating a bulk-layer of copper thereon. A copper seed layer may be deposited with different processes, including CVD, PVD, and electroplating. With electroplating methods for depositing a copper seed layer, disclosed are methods for depositing a copper alloy seed layer, methods for depositing a copper seed layer on the semi-noble metal layer with a non-corrosive electrolyte, methods of treating the semi-noble metal layer that the copper seed layer is deposited on, and methods for promoting a more uniform copper seed layer deposition across a semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile