The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Apr. 01, 2011
Applicants:

RU Huang, Beijing, CN;

Qianqian Huang, Beijing, CN;

Zhan Zhan, Beijing, CN;

Yangyuan Wang, Beijing, CN;

Inventors:

Ru Huang, Beijing, CN;

Qianqian Huang, Beijing, CN;

Zhan Zhan, Beijing, CN;

Yangyuan Wang, Beijing, CN;

Assignee:

Peking University, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 21/00 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention discloses a combined-source MOS transistor with a Schottky Barrier and a comb-shaped gate structure, and a method for manufacturing the same. The combined-source MOS transistor includes: a control gate electrode layer, a gate dielectric layer, a semiconductor substrate, a highly-doped source region and a highly-doped drain region, wherein a Schottky source region is connected to a side of the highly-doped source region which is far from a channel, one end of the control gate extends to the highly-doped source region, the extended gate region is an extension gate in a form of a comb-shaped and the original control gate region is a main gate; an active region covered by the extension gate is also a channel region, and is a substrate material; the highly-doped source region which is formed by highly doping is located on both sides of each comb finger of the extension gate; and a Schottky junction is formed at a location where the Schottky source region and the channel under the extension gate are located. As compared with an existing MOSFET, in the invention, a higher turn-on current, a lower leakage current and a steeper subthreshold slope may be obtained under the same process condition and the same active region size.


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