The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 04, 2008
Bon-woong Koo, Andover, MA (US);
Victor Benveniste, Lyle, WA (US);
Christopher A. Rowland, Rockport, MA (US);
Craig R. Chaney, Rockport, MA (US);
Frank Sinclair, Quincy, MA (US);
Neil J. Bassom, Hamilton, MA (US);
Bon-Woong Koo, Andover, MA (US);
Victor Benveniste, Lyle, WA (US);
Christopher A. Rowland, Rockport, MA (US);
Craig R. Chaney, Rockport, MA (US);
Frank Sinclair, Quincy, MA (US);
Neil J. Bassom, Hamilton, MA (US);
Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);
Abstract
An ion source that utilizes exited and/or atomic gas injection is disclosed. In an ion beam application, the source gas can be used directly, as it is traditionally supplied. Alternatively or additionally, the source gas can be altered by passing it through a remote plasma source prior to being introduced to the ion source chamber. This can be used to create excited neutrals, heavy ions, metastable molecules or multiply charged ions. In another embodiment, multiple gasses are used, where one or more of the gasses are passed through a remote plasma generator. In certain embodiments, the gasses are combined in a single plasma generator before being supplied to the ion source chamber. In plasma immersion applications, plasma is injected into the process chamber through one or more additional gas injection locations. These injection locations allow the influx of additional plasma, produced by remote plasma sources external to the process chamber.