The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Feb. 22, 2010
Applicants:
IN Sang Yoon, Ichon-si, KR;
Johyun Bae, Seoul, KR;
Deokkyung Yang, Hanam-si, KR;
Inventors:
Assignee:
STATS Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/02 (2006.01); H01L 23/06 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of a semiconductor packaging system includes: providing a base substrate having edges; mounting an electrical interconnect on the base substrate; and applying an encapsulant having a reference marker and an opening over the electrical interconnect, the reference marker around the electrical interconnect based on physical locations of the edges.