The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Oct. 22, 2010
Hao-wei Ku, Zhudong Township, TW;
Chung Yu Wang, Hsinchu, TW;
Yu-sheng Tang, Qishan Township, TW;
Hsin-hung Chen, Hsinchu, TW;
Hao-yu Yang, Taoyuan, TW;
Ching-yi Chen, Banqiao, TW;
Hsiao-wen Lee, Hsinchu, TW;
Chi Xiang Tseng, Kaohsiung, TW;
Sheng-shin Guo, Wufeng Township, TW;
Tien-ming Lin, Hsinchu, TW;
Shang-yu Tsai, Hsinchu, TW;
Hao-Wei Ku, Zhudong Township, TW;
Chung Yu Wang, Hsinchu, TW;
Yu-Sheng Tang, Qishan Township, TW;
Hsin-Hung Chen, Hsinchu, TW;
Hao-Yu Yang, Taoyuan, TW;
Ching-Yi Chen, Banqiao, TW;
Hsiao-Wen Lee, Hsinchu, TW;
Chi Xiang Tseng, Kaohsiung, TW;
Sheng-Shin Guo, Wufeng Township, TW;
Tien-Ming Lin, Hsinchu, TW;
Shang-Yu Tsai, Hsinchu, TW;
TSMC Solid State Lighting Ltd., Hsinchu, TW;
Abstract
An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.