The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Apr. 01, 2011
Applicants:

RU Huang, Beijing, CN;

Quanxin Yun, Beijing, CN;

Xia an, Beijing, CN;

Xing Zhang, Beijing, CN;

Inventors:

Ru Huang, Beijing, CN;

Quanxin Yun, Beijing, CN;

Xia An, Beijing, CN;

Xing Zhang, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/332 (2006.01); H01L 21/335 (2006.01); H01L 21/8232 (2006.01); H01L 21/336 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to CMOS ultra large scale integrated circuits, and provides a method for introducing channel stress and a field effect transistor fabricated by the same. According to the present invention, a strained dielectric layer is interposed between source/drain regions and a substrate of a field effect transistor, and a strain is induced in a channel by the strained dielectric layer which directly contacts the substrate, so as to improve a carrier mobility of the channel and a performance of the device. The specific effects of the invention include: a tensile strain may be induced in the channel by using the strained dielectric layer having a tensile strain in order to increase an electron mobility of the channel; a compressive strain may be induced in the channel by using the strained dielectric layer having a compressive strain in order to increase a hole mobility of the channel. According to the invention, not only an effectiveness of the introduction of channel stress is ensued, but the device structure of the field effect transistor is also improved fundamentally, so that a capability for suppressing a short channel effect of the device is increased.


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