The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Feb. 22, 2011
Richard S. Graf, Gray, ME (US);
Haruo Itoh, Shiga-ken, JP;
Wai Ling Chung-maloney, Waterbury Center, VT (US);
Richard S. Graf, Gray, ME (US);
Haruo Itoh, Shiga-ken, JP;
Wai Ling Chung-Maloney, Waterbury Center, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Solutions for determining intra-die wirebond pad placement locations in an integrated circuit (IC) die are disclosed. In one embodiment, a method includes generating a dividing band in the IC die, the dividing band dividing the IC die into a first region and a second region; determining a voltage (IR) drop across the first region and the second region; comparing the IR drops across the regions; and in response to the IR drops being substantially unequal, moving the dividing band, determining new IR drops across the regions, and comparing the new IR drops until the IR drops are substantially equal. The dividing band may provide desired locations for intra-die wirebond pads.