Wai Ling Chung-Maloney

Title: Innovations by Wai Ling Chung-Maloney

Introduction

Wai Ling Chung-Maloney is a notable inventor based in Waterbury Center, Vermont. She has made significant contributions to the field of integrated circuits, holding three patents that showcase her innovative spirit and technical expertise.

Latest Patents

One of her latest patents is focused on determining intra-die wirebond pad placement locations in integrated circuits. This patent discloses solutions for generating a dividing band in the IC die, which divides the die into two regions. The method involves determining voltage drops across these regions and adjusting the dividing band until the voltage drops are substantially equal, thereby providing optimal locations for wirebond pads.

Another significant patent involves the method and apparatus for optimizing the IO collar of a peripheral image. This innovation aims to reduce the die size of an IC chip by arranging rotated IO cells around the edges of the chip. The approach minimizes the number of unused IO cells, enhancing the efficiency of the design.

Career Highlights

Wai Ling Chung-Maloney is currently employed at International Business Machines Corporation (IBM), where she continues to develop cutting-edge technologies. Her work has had a profound impact on the efficiency and functionality of integrated circuits.

Collaborations

Throughout her career, she has collaborated with esteemed colleagues such as Douglas Willard Stout and Steven Joseph Urish. These partnerships have further enriched her contributions to the field.

Conclusion

Wai Ling Chung-Maloney exemplifies the spirit of innovation in the technology sector. Her patents reflect her commitment to advancing integrated circuit design and optimization. Her work continues to influence the industry and inspire future inventors.