Haruo Itoh

Title: Haruo Itoh: Innovator in Integrated Circuit Design

Introduction

Haruo Itoh is a notable inventor based in Shiga-ken, Japan. He has made significant contributions to the field of integrated circuit design, particularly in the area of wirebond pad placement. His innovative approach has led to advancements that enhance the efficiency and effectiveness of integrated circuits.

Latest Patents

Haruo Itoh holds a patent for a method that determines intra-die wirebond pad placement locations in integrated circuits. This patent outlines solutions for generating a dividing band within the IC die, which separates the die into two regions. The method involves determining voltage drops across these regions and adjusting the dividing band until the voltage drops are substantially equal. This process ultimately provides optimal locations for intra-die wirebond pads, improving the overall design of integrated circuits.

Career Highlights

Itoh is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field, contributing to the advancement of technology in integrated circuits.

Collaborations

Some of Haruo Itoh's coworkers include Richard Stephen Graf and Wai Ling Chung-Maloney. Their collaborative efforts have furthered the development of innovative solutions in integrated circuit technology.

Conclusion

Haruo Itoh's contributions to integrated circuit design through his patent demonstrate his expertise and commitment to innovation. His work continues to influence the field and pave the way for future advancements in technology.