The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Jan. 26, 2010
Katrina Mikhaylichenko, San Jose, CA (US);
Denis Syomin, San Jose, CA (US);
Qian Fu, Fremont, CA (US);
Glenn W. Gale, Tokyo, JP;
Shenjian Liu, Fremont, CA (US);
Mark H. Wilcoxson, Oakland, CA (US);
Katrina Mikhaylichenko, San Jose, CA (US);
Denis Syomin, San Jose, CA (US);
Qian Fu, Fremont, CA (US);
Glenn W. Gale, Tokyo, JP;
Shenjian Liu, Fremont, CA (US);
Mark H. Wilcoxson, Oakland, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A method is provided for processing a wafer used in fabricating semiconductor devices. The method can comprise forming high-aspect ratio features on the wafer, which is followed by wet processing and drying. During drying, pattern collapse can occur. This pattern collapse can be repaired to allow for additional processing of the wafer. In some instance, pattern collapse can be repaired via etching where the etching breaks bonds that can have formed during pattern collapse.