The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2013

Filed:

Jan. 27, 2009
Applicants:

Makoto Fukushima, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Shingo Saito, Tokyo, JP;

Inventors:

Makoto Fukushima, Tokyo, JP;

Tetsuji Togawa, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Shingo Saito, Tokyo, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.


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