The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Oct. 15, 2010
Chun-ren Cheng, Hsin-Chu, TW;
Yi-hsien Chang, Shetou Township, Changhua County, TW;
Allen Timothy Chang, Hsinchu, TW;
Ching-ray Chen, Taipei, TW;
Li-cheng Chu, Taipei, TW;
Hung-hua Lin, Taipei, TW;
Yuan-chih Hsieh, Hsinchu, TW;
Lan-lin Chao, Sindian, TW;
Chun-Ren Cheng, Hsin-Chu, TW;
Yi-Hsien Chang, Shetou Township, Changhua County, TW;
Allen Timothy Chang, Hsinchu, TW;
Ching-Ray Chen, Taipei, TW;
Li-Cheng Chu, Taipei, TW;
Hung-Hua Lin, Taipei, TW;
Yuan-Chih Hsieh, Hsinchu, TW;
Lan-Lin Chao, Sindian, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device.