The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2013

Filed:

Sep. 15, 2005
Applicants:

Jaim Nulman, Palo Alto, CA (US);

Sergio Edelstein, Los Gatos, CA (US);

Mani Subramani, San Jose, CA (US);

Zheng Xu, Foster City, CA (US);

Howard E. Grunes, Santa Cruz, CA (US);

Avi Tepman, Cupertino, CA (US);

John C. Forster, San Francisco, CA (US);

Praburam Gopalraja, Sunnyvale, CA (US);

Inventors:

Jaim Nulman, Palo Alto, CA (US);

Sergio Edelstein, Los Gatos, CA (US);

Mani Subramani, San Jose, CA (US);

Zheng Xu, Foster City, CA (US);

Howard E. Grunes, Santa Cruz, CA (US);

Avi Tepman, Cupertino, CA (US);

John C. Forster, San Francisco, CA (US);

Praburam Gopalraja, Sunnyvale, CA (US);

Assignee:

Applied Materials Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.


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