The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8377550 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 19, 2013

Filed:

Dec. 29, 2009
Applicants:

Rajasekaran Swaminathan, Chandler, AZ (US);

Hong Dong, Chandler, AZ (US);

Sandeep Razdan, Chandler, AZ (US);

Nisha Ananthakrisnan, Chandler, AZ (US);

Rahul Manepalli, Chandler, AZ (US);

Inventors:

Rajasekaran Swaminathan, Chandler, AZ (US);

Hong Dong, Chandler, AZ (US);

Sandeep Razdan, Chandler, AZ (US);

Nisha Ananthakrisnan, Chandler, AZ (US);

Rahul Manepalli, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/20 (2006.01); B32B 15/092 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.


Find Patent Forward Citations

Swaminathan, Rajasekaran. (2013). Flip chip package containing novel underfill materials (U.S. Patent No. 8377550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8377550

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