The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Jun. 08, 2010
Dong Kyun Sohn, Gyeonggi-Do, KR;
Wuping Liu, Singapore, SG;
Fan Zhang, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Jing Hui LI, Singapore, SG;
Bei Chao Zhang, Singapore, SG;
Luying Du, Singapore, SG;
Wei Liu, Singapore, SG;
Yeow Kheng Lim, Singapore, SG;
Dong Kyun Sohn, Gyeonggi-Do, KR;
Wuping Liu, Singapore, SG;
Fan Zhang, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Jing Hui Li, Singapore, SG;
Bei Chao Zhang, Singapore, SG;
Luying Du, Singapore, SG;
Wei Liu, Singapore, SG;
Yeow Kheng Lim, Singapore, SG;
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit system includes: fabricating a substrate having an integrated circuit; applying a low-K dielectric layer over the integrated circuit; forming a via and a trench, in the low-K dielectric layer, over the integrated circuit; forming a structure surface by a chemical-mechanical planarization (CMP) process; and applying a direct implant to the structure surface for forming an implant layer and a metal passivation layer including repairing damage, to the low-K dielectric layer, caused by the CMP process.