The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2013
Filed:
Jan. 18, 2011
Charan Gurumurthy, Gilbert, AR (US);
Sanka Ganesan, Chandler, CA (US);
Chandrashekar Ramaswamy, Chandler, AZ (US);
Mark Hlad, Chandler, AZ (US);
Charan Gurumurthy, Gilbert, AR (US);
Sanka Ganesan, Chandler, CA (US);
Chandrashekar Ramaswamy, Chandler, AZ (US);
Mark Hlad, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.