The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Mar. 09, 2011
Hiroyuki Uramachi, Tokyo, JP;
Koji Tanimoto, Tokyo, JP;
Yuji Ariyoshi, Tokyo, JP;
Masahiro Kawai, Tokyo, JP;
Shinichiro Hidaka, Tokyo, JP;
Naoyuki Kishikawa, Tokyo, JP;
Hiroyuki Uramachi, Tokyo, JP;
Koji Tanimoto, Tokyo, JP;
Yuji Ariyoshi, Tokyo, JP;
Masahiro Kawai, Tokyo, JP;
Shinichiro Hidaka, Tokyo, JP;
Naoyuki Kishikawa, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a flow rate measuring apparatus which suppresses deformation of a base main body due to vibration of a pipe so as to be able to reduce occurrence of disconnection of wires due to the vibration of the pipe. The flow rate measuring apparatus includes a bonding portion () corresponding to a deformation suppression portion provided between an inner wall surface () of a flange () of a base () and an outer circumferential wall surface () of a cover () covering a circuit board (), which is opposed to the inner wall surface (), for connecting the flange () and the cover () to suppress the deformation of a base main body () of the base () due to vibration of an intake pipe ().