The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Aug. 05, 2011
Applicants:

Min-sung Song, Hwaseong-si, KR;

Soon-moon Jung, Seongnam-si, KR;

Han-soo Kim, Suwon-si, KR;

Young-seop Rah, Yongi-si, KR;

Won-seok Cho, Suwon-si, KR;

Yang-soo Son, Hwaseong-si, KR;

Jong-hyuk Kim, Osan-si, KR;

Young-chul Jang, Seoul, KR;

Inventors:

Min-Sung Song, Hwaseong-si, KR;

Soon-Moon Jung, Seongnam-si, KR;

Han-Soo Kim, Suwon-si, KR;

Young-Seop Rah, Yongi-si, KR;

Won-Seok Cho, Suwon-si, KR;

Yang-Soo Son, Hwaseong-si, KR;

Jong-Hyuk Kim, Osan-si, KR;

Young-Chul Jang, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

On embodiment of a contact structure may include a lower insulation layer on a lower substrate, an upper substrate on the lower insulation layer, a groove penetrating the upper substrate to extend into the lower insulation layer, the groove below an interface between the upper substrate and the lower insulation layer, an upper insulation layer in the groove, and a contact plug penetrating the upper insulation layer in the groove to extend into the lower insulation layer.


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