The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Mar. 28, 2008
Applicants:
Tadashi Aoto, Miyagi-gun, JP;
Eiichiro Kikuchi, Nirasaki, JP;
Masakazu Higuma, Nirasaki, JP;
Kimihiro Higuchi, Nirasaki, JP;
Inventors:
Tadashi Aoto, Miyagi-gun, JP;
Eiichiro Kikuchi, Nirasaki, JP;
Masakazu Higuma, Nirasaki, JP;
Kimihiro Higuchi, Nirasaki, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 61/04 (2006.01); H05H 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.