The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
May. 08, 2007
John Michael Cotte, New Fairfield, CT (US);
Hanyi Ding, Essex Junction, VT (US);
Kai Di Feng, Hopewell Junction, NY (US);
Zhong-xiang He, Essex Junction, VT (US);
Nils D. Hoivik, Pleasantville, NY (US);
Xuefeng Liu, South Burlington, VT (US);
John Michael Cotte, New Fairfield, CT (US);
Hanyi Ding, Essex Junction, VT (US);
Kai Di Feng, Hopewell Junction, NY (US);
Zhong-Xiang He, Essex Junction, VT (US);
Nils D. Hoivik, Pleasantville, NY (US);
Xuefeng Liu, South Burlington, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic material may be affixed to the package cover by an adhesive. The magnetic material may be formed directly on the package cover by one of deposition, sputtering or spraying. The magnetic material may be affixed to the integrated circuit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile