The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
May. 18, 2011
Applicants:
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Soon Hock Tong, Melaka, MY;
Kwai Hong Wong, Melaka, MY;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Soon Hock Tong, Melaka, MY;
Kwai Hong Wong, Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.