The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Feb. 17, 2011
Salman Akram, Boise, ID (US);
William Mark Hiatt, Eagle, ID (US);
Steven Oliver, Boise, ID (US);
Alan G. Wood, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
James M. Wark, Boise, ID (US);
Kyle K. Kirby, Boise, ID (US);
Salman Akram, Boise, ID (US);
William Mark Hiatt, Eagle, ID (US);
Steven Oliver, Boise, ID (US);
Alan G. Wood, Boise, ID (US);
Sidney B. Rigg, Meridian, ID (US);
James M. Wark, Boise, ID (US);
Kyle K. Kirby, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer.