The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2012

Filed:

Nov. 09, 2009
Applicants:

Kangguo Cheng, Albany, NY (US);

Bruce B. Doris, Albany, NY (US);

Steven J. Holmes, Hopewell Junction, VT (US);

Xuefeng Hua, Guilderland, NY (US);

Ying Zhang, Yorktown Heights, NY (US);

Inventors:

Kangguo Cheng, Albany, NY (US);

Bruce B. Doris, Albany, NY (US);

Steven J. Holmes, Hopewell Junction, VT (US);

Xuefeng Hua, Guilderland, NY (US);

Ying Zhang, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabrication of features for an integrated circuit includes patterning a mandrel layer to include structures having at least one width on a surface of an integrated circuit device. Exposed sidewalls of the structures are reacted to integrally form a new compound in the sidewalls such that the new compound extends into the exposed sidewalls by a controlled amount to form pillars. One or more layers below the pillars are etched using the pillars as an etch mask to form features for an integrated circuit device.


Find Patent Forward Citations

Loading…