The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Mar. 06, 2007
Koji Maeda, Tokyo, JP;
Ryuichi Kosuge, Tokyo, JP;
Hiroshi Shimomoto, Tokyo, JP;
Soichi Isobe, Tokyo, JP;
Toru Niwa, Aichi, JP;
Koji Maeda, Tokyo, JP;
Ryuichi Kosuge, Tokyo, JP;
Hiroshi Shimomoto, Tokyo, JP;
Soichi Isobe, Tokyo, JP;
Toru Niwa, Aichi, JP;
Ebara Corporation, Tokyo, JP;
CKD Corporation, Aichi, JP;
Abstract
A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liquid supplied from the liquid supply source, an electropneumatic regulator for supplying a pressurized gas from a gas source to the supply tube, and a pipe having no narrow portion for controlling a flow rate of the liquid. The supply tube is vertically disposed. The pressurized gas supply mechanism is operable to supply the pressurized gas to the supply tube so as to supply the liquid, filling the supply tube, to the polishing surface of the polishing table via the pipe and a polishing liquid supply pipe.