The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 07, 2008
Felix P. Anderson, Colchester, VT (US);
William Cote, Poughquag, NY (US);
Daniel C. Edelstein, White Plains, NY (US);
Thomas L. Mcdevitt, Underhill, VT (US);
Anthony K. Stamper, Williston, VT (US);
Felix P. Anderson, Colchester, VT (US);
William Cote, Poughquag, NY (US);
Daniel C. Edelstein, White Plains, NY (US);
Thomas L. McDevitt, Underhill, VT (US);
Anthony K. Stamper, Williston, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion thereof devoid of a fluorine boundary layer. The structure further includes a copper wire in the trench having at least a bottom portion thereof in contact with the non-fluoride boundary layer of the trench. A lead free solder bump is in electrical contact with the copper wire.