The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Jan. 18, 2007
Hsin-hui Lee, Kaohsiung, TW;
Chien-chao Huang, Hsin-Chu, TW;
Chao-hsiung Wang, Hsinchu, TW;
Fu-liang Yang, Hsin-Chu, TW;
Chenming HU, Hsinchu, TW;
Hsin-Hui Lee, Kaohsiung, TW;
Chien-Chao Huang, Hsin-Chu, TW;
Chao-Hsiung Wang, Hsinchu, TW;
Fu-Liang Yang, Hsin-Chu, TW;
Chenming Hu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co. Ltd, Hsin-Chu, TW;
Abstract
A method provides for dicing a wafer having a base material with a diamond structure. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The wafer is then diced through at least one line along a direction at a predetermined offset angle from a natural cleavage direction of the diamond structure. A wafer is produced with one or more dies formed thereon with at least one of its edges at an offset angle from a natural cleavage direction of a diamond structure of a base material forming the wafer. At least one dicing line has one or more protection elements for protecting the dies from undesired cracking while the wafer is being diced along the dicing line.