The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Mar. 18, 2011
Takayuki Toba, Kanagawa-ken, JP;
Tohru Ozaki, Tokyo, JP;
Toshiki Hisada, Kanagawa-ken, JP;
Hiromitsu Mashita, Kanagawa-ken, JP;
Takafumi Taguchi, Kanagawa-ken, JP;
Takayuki Toba, Kanagawa-ken, JP;
Tohru Ozaki, Tokyo, JP;
Toshiki Hisada, Kanagawa-ken, JP;
Hiromitsu Mashita, Kanagawa-ken, JP;
Takafumi Taguchi, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor device includes a plurality of first interconnects, a second interconnect, a third interconnect, and a plurality of conductive members. The plurality of first interconnects are arranged periodically to extend in one direction. The second interconnect is disposed outside a group of the plurality of first interconnects to extend in the one direction. The third interconnect is provided between the group and the second interconnect. The plurality of conductive members are disposed on a side opposite to the group as viewed from the second interconnect. A shortest distance between the first interconnect and the third interconnect, a shortest distance between the third interconnect and the second interconnect, and a shortest distance between the first interconnects are equal. A shortest distance between the second interconnect and the conductive member is longer than the shortest distance between the first interconnects.