The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Sep. 14, 2009
Toru Taniguchi, Tokyo, JP;
Etsuro Morita, Tokyo, JP;
Satoshi Matagawa, Tokyo, JP;
Seiji Harada, Tokyo, JP;
Isoroku Ono, Tokyo, JP;
Mitsuhiro Endo, Tokyo, JP;
Fumihiko Yoshida, Tokyo, JP;
Toru Taniguchi, Tokyo, JP;
Etsuro Morita, Tokyo, JP;
Satoshi Matagawa, Tokyo, JP;
Seiji Harada, Tokyo, JP;
Isoroku Ono, Tokyo, JP;
Mitsuhiro Endo, Tokyo, JP;
Fumihiko Yoshida, Tokyo, JP;
Sumitomo Mitsubishi Silicon Corporation, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface of said semiconductor wafer by driving said carrier plate to make a circular motion associated with no rotation on its own axis within a plane parallel with a surface of said carrier plate between a pair of polishing members disposed to face to each other, by using an abrasive body with a semiconductor wafer sink rate different in polishing from that of an abrasive body for one of a polishing member on an upper surface plate and a polishing member on a lower surface plate so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer, or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.