The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Nov. 12, 2010
Andrew R. Wank, Avondale, PA (US);
Donna M. Alden, Bear, DE (US);
Joseph K. SO, Wilmington, DE (US);
Robert Gargione, Middletown, DE (US);
Mark E. Gazze, Lincoln University, PA (US);
David Drop, West Grove, PA (US);
Colin F. Cameron, Jr., Delran, NJ (US);
Mai Tieu Banh, Oakville, CA;
Shawn Riley, Wilmington, DE (US);
Andrew R. Wank, Avondale, PA (US);
Donna M. Alden, Bear, DE (US);
Joseph K. So, Wilmington, DE (US);
Robert Gargione, Middletown, DE (US);
Mark E. Gazze, Lincoln University, PA (US);
David Drop, West Grove, PA (US);
Colin F. Cameron, Jr., Delran, NJ (US);
Mai Tieu Banh, Oakville, CA;
Shawn Riley, Wilmington, DE (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.