The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Nov. 11, 2009
Chih-wei Hsu, Chuang-Hua, TW;
Yu-jen Cheng, Hsinchu, TW;
Wen-pin Liu, Hsin-Chu, TW;
Shun-ping Wang, Hsin-Chu, TW;
Shin-rung LU, Chu-Pei, TW;
JO Fei Wang, Hsin-Chu, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Andy Tsen, Chung-Ho, TW;
Chun-hsien Lin, Hsin-Chu, TW;
Chih-Wei Hsu, Chuang-Hua, TW;
Yu-Jen Cheng, Hsinchu, TW;
Wen-Pin Liu, Hsin-Chu, TW;
Shun-Ping Wang, Hsin-Chu, TW;
Shin-Rung Lu, Chu-Pei, TW;
Jo Fei Wang, Hsin-Chu, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Andy Tsen, Chung-Ho, TW;
Chun-Hsien Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.