The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2012

Filed:

Aug. 04, 2011
Applicants:

Hsien-wei Chen, Sinying, TW;

Chung-ying Yang, Taoyuan, TW;

Ying-ju Chen, Tuku Township, TW;

Shih-wei Liang, Dajia Township, TW;

Ching-jung Yang, Pingzhen, TW;

Inventors:

Hsien-Wei Chen, Sinying, TW;

Chung-Ying Yang, Taoyuan, TW;

Ying-Ju Chen, Tuku Township, TW;

Shih-Wei Liang, Dajia Township, TW;

Ching-Jung Yang, Pingzhen, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor chip includes a corner stress relief (CSR) region. An enhanced structure connects sides of a seal ring structure to surround the CSR region. A device under test (DUT) structure is disposed on the CSR region. A set of probe pad structures is disposed on the CSR region. Two of the set of probe pad structures are electrically connect to the DUT structure.


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