The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Nov. 27, 2008
Te-hung Wu, Tainan County, TW;
Sheng-yuan Huang, Yun-Lin County, TW;
Cheng-te Wang, Hsinchu County, TW;
Chia-wei Huang, Kao-Hsiung, TW;
Ping-i Hsieh, Tainan County, TW;
Po-i Lee, Kaohsiung County, TW;
Chuen Huei Yang, Taipei, TW;
Pei-ru Tsai, Tainan County, TW;
Te-Hung Wu, Tainan County, TW;
Sheng-Yuan Huang, Yun-Lin County, TW;
Cheng-Te Wang, Hsinchu County, TW;
Chia-Wei Huang, Kao-Hsiung, TW;
Ping-I Hsieh, Tainan County, TW;
Po-I Lee, Kaohsiung County, TW;
Chuen Huei Yang, Taipei, TW;
Pei-Ru Tsai, Tainan County, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A method to determine a process window is disclosed. First, a pattern data is provided. Second, a bias set is determined. Then, a resizing procedure is performed on the pattern data in accordance with the bias set to obtain a usable final resized pattern to be a target pattern of changed area. The final resized pattern is consistent with a minimum spacing rule, a contact to poly rule and a contact to metal rule. Accordingly, the target pattern is output.